| 000 | 00986cam a22002534a 4500 | ||
|---|---|---|---|
| 008 | 100227s2008 nyua b 001 0 eng | ||
| 010 | _a 2008016996 | ||
| 020 | _a 0071459065 | ||
| 020 | _a 9780071459068 | ||
| 035 | _a(Sirsi) u3956 | ||
| 040 |
_a EG-CaNU _c EG-CaNU _d EG-CaNU |
||
| 042 | _a ncode | ||
| 082 | 0 | 0 |
_a 621.381046 _2 22 |
| 100 | 1 |
_a Tummala, Rao R., _d 1942- _97806 |
|
| 245 | 1 | 0 |
_a Introduction to system-on-package (SOP) : _b miniaturization of the entire system / _c Rao R. Tummala, Madhavan Swaminathan. |
| 260 |
_a New York : _b McGraw-Hill, _c c2008. |
||
| 300 |
_a xx, 785 p. : _b ill. ; _c 25 cm. |
||
| 504 | _a Includes bibliographical references and index. | ||
| 650 | 0 |
_a Multichip modules (Microelectronics) _x Design and construction. _97807 |
|
| 650 | 0 |
_a Microelectronic packaging. _97808 |
|
| 700 | 1 |
_a Swaminathan, Madhavan. _93061 |
|
| 596 | _a1 | ||
| 999 |
_c2938 _d2938 |
||