| 000 | 00911cam a22002534a 4500 | ||
|---|---|---|---|
| 008 | 090802s2009 maua b 001 0 eng | ||
| 010 | _a2009275951 | ||
| 020 | _a1596932465 | ||
| 035 | _a(Sirsi) u2174 | ||
| 040 |
_aEG-CaNU _cEG-CaNU _dEG-CaNU |
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| 042 | _ancode | ||
| 082 | 0 | 0 |
_a621.381 _2 22 |
| 245 | 0 | 0 |
_aIntegrated interconnect technologies for 3D nanoelectronic systems / _c Muhannad S. Bakir, James D. Meindl, editors. |
| 260 |
_aBoston, Mass. ; _a London : _b Artech House, _c c2009. |
||
| 300 |
_axx, 528 p. : _b ill. ; _c 26 cm. |
||
| 490 | 0 | _aIntegrated microsystems series | |
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 |
_aInterconnects (Integrated circuit technology) _91035 |
|
| 650 | 0 |
_aTelecommunication systems. _93769 |
|
| 650 | 0 |
_aNanoelectronics. _91939 |
|
| 700 | 1 |
_aBakir, Muhannad S. _93770 |
|
| 700 | 1 |
_aMeindl, James D., _d 1933- _93771 |
|
| 596 | _a1 | ||
| 999 |
_c1275 _d1275 |
||